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Special NoticeAmendment 2

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

DEPT OF THE ARMY

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Response status

Due in 8 days

Sep 16, 2026, 10:00 PM UTC

Responses remain open.

Posted
Aug 17, 2026
Archive date
Oct 1, 2026
SAM status
Active

Answer-first brief

What the source record says

  • DEPT OF THE ARMY published this special notice.
  • The notice uses NAICS 541715 (Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)).

Procurement identity

Notice ID
7dc8c0ba9a234be8872e510a09cf2d38
Solicitation
W52P1J26R0001
Base type
Special Notice
Version
2 of 2

Solicitation facts

Structured fields from the current SAM notice version. A dash means the source did not publish a value.

Notice type
Special Notice
Solicitation number
W52P1J26R0001
NAICS
541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
PSC
R425 — SUPPORT- PROFESSIONAL: ENGINEERING/TECHNICAL
Set-aside
—
Set-aside code
—
Posted
Aug 17, 2026
Responses due
Sep 16, 2026, 10:00 PM UTC
Archive date
Oct 1, 2026
Archive type
auto15
Base type
Special Notice
Organization type
AGENCY
Benchmark category
—
Category confidence
—
Category source
—
Last seen
Sep 9, 2026

Buyer and place

Office hierarchy and place of performance as published.

Department
DEPT OF DEFENSE
Department code
—
Subagency
DEPT OF THE ARMY
Subagency code
—
Office
DEPT OF THE ARMY
Organization path
—
Organization path codes
—
Office address
—
Place of performance
—
City code
—
State
—
State code
—
Postal code
—
Country
—

Points of contact

Contact details from the current notice version.

Notice description

Source text reproduced without an AI summary.

Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.

Comparable award range

Historical award values for work matched by the fixed rubric—not an estimate of this opportunity.

No past awards scored highly enough to form a comparable range.

Comparable awards

The match score is decomposed so each comparison can be challenged.

No comparable awards are attached to this notice.

Amendment history

A version is preserved whenever the normalized notice contents change.

VersionNotice typeObservedResponses dueContent hash
1Special NoticeAug 19, 2026Sep 16, 2026, 10:00 PM UTCbe3a4e7236f1ac9a
2Special NoticeAug 28, 2026Sep 16, 2026, 10:00 PM UTC2ffd712eb30ead72

Record provenance

Field-level lineage for the current opportunity version.

FieldSourceSource as ofParserTransform
agency_nameSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
archive_dateSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
archive_typeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
base_typeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
contactsSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
country_codeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
descriptionSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
naics_codeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
notice_idSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
notice_typeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
office_nameSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
organization_typeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
posted_dateSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
psc_codeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
response_deadlineSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
sam_urlSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
solicitation_numberSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
subagency_nameSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
titleSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3
upstream_activeSAM.gov Contract OpportunitiesAug 19, 2026sam_opportunity_snapshot@2026.08.22026.08.3

Sources and method

Figures on this page are computed from public federal award records. Numbers are never estimated or generated; where a figure is withheld, the reason is stated rather than filled in.

  1. 1Notice fields come from the SAM.gov contract opportunities record last seen Sep 9, 2026. SAM.gov remains authoritative.

Note 1 covers the solicitation record. No synthetic FAQ or inferred solicitation value is published.

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies — federal contract opportunity · BidBenchmark