Contractor
SIENNA TECHNOLOGIES, INC.
MUKILTEO, WA
- UEI
- W8VZALJ8J617
- Parent UEI
- W8VZALJ8J617
- Resolved by
- uei
- Confidence
- 1.000
Obligated to date
$261,5401
Awards
3
Agencies served
1
Active from Jun 30, 2026 to Jul 31, 2026.
Recent awards
| Award | Agency | Place | First action | Current value |
|---|---|---|---|---|
| 80NSSC26P0287 SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS | National Aeronautics and Space Administration | WA | Jul 31, 2026 | $136,040 |
| 80NSSC24PC199 MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS | National Aeronautics and Space Administration | WA | Jul 31, 2026 | $65,500 |
| 80NSSC26P0915 80NSSC24PC199 MULTICHIP MODULE PACKAGE FOR SIC PRESSURE SENSORS | National Aeronautics and Space Administration | WA | Jun 30, 2026 | $60,000 |
Sources and method
Figures on this page are computed from public federal award records. Numbers are never estimated or generated; where a figure is withheld, the reason is stated rather than filled in.
Totals sum obligations across every award attributed to this contractor. Obligations are cumulative funding actions, not the value of work delivered.
- 1Awards are attributed by Unique Entity Identifier W8VZALJ8J617, the government's own recipient identifier, not by name matching.
- 2Award records from USAspending.gov, last refreshed Aug 10, 2026.